Author: Okii, Y.
Paper Title Page
THPO097 Recent Results for Study of Ceramic and Copper Plating for Power Couplers 905
  • Y. Yamamoto, E. Kako, S. Michizono
    KEK, Ibaraki, Japan
  • E. Cenni
    CEA/IRFU, Gif-sur-Yvette, France
  • A. Four
    CEA/DRF/IRFU, Gif-sur-Yvette, France
  • Y. Okii
    Nomura Plating Co, Ltd., Osaka, Japan
  KEK has conducted a survey to select an optimum ceramic after withdrawal by a domestic manufacturing company two years ago. For this selection, there are four important items on the properties of ceramic; that is, relative permittivity, dielectric loss tangent, surface and volume resistance, and secondary electron emission coefficient. For measurements of these parameters, five kinds of ceramic samples supplied from three companies were measured using three kinds of measurement systems. For measurement of secondary electron emission, scanning electron microscope (SEM) with beam blanking system was used. On the other hand, residual resistivity ratio (RRR) for copper plating, which is the most important item for quality control, has also been carried out while changing plating thickness and acid temperature. In this report, the recent results for these studies will be presented in detailed.  
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About • paper received ※ 12 September 2018      issue date ※ 18 January 2019  
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